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Updated£º2010.04.22 File Size£º10K Views£º
 
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Technical specifications table

1. Basis brasses: oxygen-free copper

2. Basis brasses electrical resistivity: oxygen-free copper wire¡Ü0.0165¦¸mm2/m

3£®Solder tin component£º£¨1£©63%Sn 37%b    £¨2£©60%Sn 40%Pb  

£¨3£©99%Sn 1%Ag     (4) 96.5%Sn 3.5%Ag

(5) 62%Sn 36%Pb 2%Ag

4£®Solder tin melting point£º 179¡ª224¡æ

5£®Tin thickness£º One-side coated¡Ý0.02mm

6£®Extensibility£º Soft phase¡Ý25%£¬semi-soft phase¡Ý15%

7£®Width error£º¡À0.05mm  Thickness error£º¡À0.01mm

7£®Packing£ºpaper disk, ABS cylinder, paper box for cut off

 
 
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